Chip protective adhesive - copy - copy

Chip protective adhesive

Chip protective adhesive is a low temperature thermally cured one component epoxy adhesive used for bonding protective chips.

It has the following characteristics:

1. Good spreading ability, it can quickly spread to the gaps of the components and quickly flatten after dispensing.

2. Fast low-temperature heating and curing speed

3. High adhesive strength, providing reliable protection for electronic components and PCB boards.

4. Low thermal conductivity, providing excellent insulation protection for heat sensitive electronic components.

5. Long shelf life, with a shelf life greater than 48 hours in an environment of 22-28 ℃.

The selection of chip protective adhesive should be determined based on specific application requirements and chip characteristics to ensure the best protection effect.