Application of electronic products

Chip bonding epoxy adhesive

The adhesion of the sensor does not affect its sensitivity
Chip protection
Low temperature curing
Low halogen
Product description: Main applications: Adhesive protection for thermal sensitive components such as memory cards, CCD/CMOS devices, sensors, and active and passive components in PCBA assembly.
INQUIRY

explain
TT02xx is a single component low-temperature rapid curing epoxy resin adhesive. It quickly solidifies under lower temperature conditions and has excellent bonding effect. Suitable for special sensors, with good working performance and stable low-temperature storage performance.
characteristic
▪ High thixotropy:
The glue does not flow at high temperatures
▪ Low temperature heating for rapid solidification
▪ Suitable for certain special sensors
▪ High adhesive strength
▪ Low halogen: halogen content<900ppm
▪ Heating is easy to repair
▪ Long applicable period:
TT02xx has a long applicability period in an environment of 22 ℃ -28 ℃
Within 48 hours.
purpose
Thermal sensitive components such as memory cards, CCD/CMOS devices, sensors, and adhesive protection for active and passive components in PCBA assembly.