Halogen free heat curing epoxy resin adhesive

Type_ C Sealant

TP01 sealant is a heat cured one component epoxy sealing adhesive used for Type_ Sealing, sealing, and bonding of various electronic components such as interfaces, terminal connectors, driver power supplies, AC/DC modules, etc.

It has the following characteristics:

1. Good liquidity, fast leveling.

2. Quick curing by heating, without preheating the components before curing, curing at 140 degrees and 18 minutes.

3. After curing, it has high hardness and is resistant to cold and hot impacts without cracking.

4. Excellent high-temperature resistance, waterproof to IP68 level after 3 times at 260 ° C for 20 minutes or 260 ° C for 5 minutes.

5. Long shelf life: In an environment of 22 ℃ -28 ℃, the shelf life is greater than 48 hours.

6. Low halogen, can pass the dual 85 test.

Type_ Sealant C is non flammable, non corrosive, solvent free, free of volatile compounds VOC, environmentally friendly, and meets international environmental SGS testing requirements.