Application of electronic products

TADHE TDC06x patch red adhesive

Non-stringing
Fast heat curing
Strong adhesion
Excellent thermal shock resistance at high temperature
Product description: Strong Adhesion & High Temperature Resistance C0805 push force＞5.0Kg. Suitable for glass diodes, M7, IC; withstands 2 times wave soldering & drop test. Maintains good bonding strength at 260℃.
INQUIRY

TADHE SMT Epoxy Red Adhesive

Product Introduction

SMT single component epoxy red adhesive. It is red paste, heat-curable one-component epoxy adhesive. For bonding & reinforcement of SMD components.

Features & Advantages

✅Non-stringing

✅Fast heat curing

✅Strong adhesion

✅Excellent thermal shock resistance at high temperature

✅Eco-friendly quality, long shelf life

✅High temperature resistance

✅Stable glue output

Application

Bright red color. Compatible with jet dispensers, full/semi-auto high/medium/low speed dispensing machines. Works normally without temperature-controlled head. Bright red before curing with fine texture.

Non-stringing & Stable Glue Volume No stringing, no bleeding. Rounded dot profile, no nozzle clogging, consistent dispensing volume, no jumping.

Strong Adhesion & High Temperature Resistance C0805 push force＞5.0Kg. Suitable for glass diodes, M7, IC; withstands 2 times wave soldering & drop test. Maintains good bonding strength at 260℃.

Eco-friendly & Easy Inspection Reliable quality for safe use. Bright red after curing, convenient for machine vision & visual inspection. Curing status can be judged by post-cure color.

Specifications

Item	Parameter
Brand	TADHE®
Model	TDC06T / TDC06H / TDC06I
Product Name	SMT Dispensing Red Adhesive
Appearance	Red paste
Package	40g, 30g
Main Composition	Epoxy resin
Bonding Substrate	SMD electronic components
Application Method	Jet dispensing / Dot dispensing
Curing Method	Heat curing
Viscosity (25℃,5rpm)	300 - 320 Pa.s
Thixotropy Index (5.0)	6.4 (1rpm /10rpm)
Glass Transition Temp (Tg)	128℃
Specific Gravity(g/cm³)	1.24-1.28
Bond Strength(R0805)	5.0Kg (dual dots)
Dielectric Constant	3.8/1 MHz
Shelf Life	8 months (0 - 8℃)

Model Comparison Table

Item	TGCx6	TDC06x
Brand	TADHE®	TADHE®
Name	SMT Squeegee Red Adhesive	SMT Dispensing Red Adhesive
Appearance	Red paste	Red paste
Viscosity	340-360 Pa.S	300-320 Pa.S
Specific Gravity	1.34-1.36	1.24-1.28
Thixotropy Index 5.0	5.0(1rpm/10rpm)	6.4(1rpm/10rpm)
Application	Jet & screen printing	High/medium/low speed dispensers
Bond Strength	5.0Kg (dual dots)	5.0Kg (dual dots)
Package	200g /360g	Sanyo /Fuji /Panasonic cartridge

Reflow Oven Profile Reference

Recommended oven setting: 150℃ -180℃, cure for 6 minutes. 8-zone oven profile example.

The size and position of PCB mounted components affect actual temperature received by red adhesive. Optimal curing condition must be confirmed via practical test.

Operating Instructions

Key Points

This product is heat-sensitive. Keep away from heat source during storage & operation.
Clean substrate surface for best bonding performance.
Dispense at moderate speed and remove air as much as possible.
Curing rate depends on heating temperature and model, verify by actual test.
Allow bonded assembly to cool down to room temperature before applying any load.

Operating Steps

Take product out from freezer 2–3 hours in advance. Thaw at room temperature in sealed condition. Do NOT heat for thawing.
Clean and dry bonding surface, remove dirt & foreign contaminants.
Apply proper amount of adhesive on substrate.
Place into preheated equipment for thermal curing.
Do NOT add any other substances during use.
Recycle leftover adhesive into sealable container and store at 0–8℃. Do NOT pour back into original cartridge.